MANUFACTURE OF COPPERED BOARD WITH HIGH RELIABILITY FOR PRINTED WIRING BOARD HAVING BLIND VIA HOLE

摘要

PROBLEM TO BE SOLVED: To work a copper foil by having a coppered board irradiated directly with a high output carbon dioxide gas laser, and to form a compact blind via hole, and then to increase the connection reliability of the copper foil inside the hold with the surface layer copper foil. SOLUTION: Metal oxide treatment is carried out or a resin layer containing metallic compound powder, carbon powder, or metallic powder 3-97 vol% or a resin layer b whose total width is 30-200μm applied to a film is arranged on a copper foil (a) of a coppered board having at least two or more copper layers. In this case, the copper foil is irradiated directly with a high output carbon dioxide gas laser selected from among 20-60 mJ/pulse to be worked and removed, and lastly the copper foil is irradiated with energy selected from among 5-35 mJ/pulse and a land via hole c is formed. Then, both the surface and back face of the copper foil and a generated burr i is etched and removed, and gaseous treatment and humidifying treatment of the inside part of the hole are carried out, and then the hole is packed with copper plating e with 80 capacity % or higher, so that a coppered board is manufactured. Next, a printed wiring board is prepared by using this obtained coppered board.