| 发明名称 |
Electrical circuit having a metal-bonded-ceramic material or MBC component as an insulating substrate |
| 摘要 |
<p>The electronic circuit having as an insulating substrate a material or component wherein aluminum or an alloy thereof is directly joined to a part of a ceramic member, presents good resistance to heat cycles characteristics.</p> |
| 申请公布号 |
EP1243569(A2) |
申请公布日期 |
2002.09.25 |
| 申请号 |
EP20020012565 |
申请日期 |
1995.04.10 |
| 申请人 |
DOWA METALTECH CO., LTD. |
发明人 |
NAGATA, CHOJU;NING, XIAO-SHANG;SAKURABA, MASAMI;TANAKA, TOSHIKAZU;KIMURA, MASAMI |
| 分类号 |
H01L21/48;B22D19/14;B22D23/04;B23K1/19;C04B37/02;C04B41/45;C04B41/51;C04B41/81;C04B41/88;C23C2/00;C23C2/12;C23C2/36;C23C30/00;H01L23/373;H05K1/02;H05K1/03;H05K3/00;(IPC1-7):C04B41/88 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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