| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for preparation of molds, enabling thick film curing in the air and excellent in mechanical properties, molds and a method for producing molds. SOLUTION: This photosensitive resin composition is characterized by including (1) a compound having two or more ring-opening polymerization reactive groups in the molecule, (2) an ethylenically unsaturated compound simultaneously having hydroxy group and ethylenically unsaturated bond in the molecule and having >=200 molecular weight, (3) an ethylenically unsaturated compound not having hydroxy group and having two or more ethylenically unsaturated bonds in the molecule and (4) a compound generating an acid by absorbing active beam.
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