| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave filter capable of sufficiently ensuring blocking band attenuating amounts even at the time of mounting this surface acoustic wave filter on a faced-down type package. SOLUTION: This surface acoustic wave filter is provided with input and output electrodes 18 and 19, ground electrodes 20-23, first resonators 13-16 arranged between the input and output electrodes 18 and 19, second resonators 12 and 17 arranged between the input and output electrodes 18 and 19 and the ground electrodes 20-23, and capacitive patterns 24 and 25 arranged between the input and output electrodes 18 and 19 and the ground electrodes 20-23. Thus, even when this surface acoustic wave filter is mounted on a faced-down type package, blocking band attenuating amounts can be sufficiently ensured. Therefore, it is possible to realize both miniaturization and high performance operation.
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