| 摘要 |
FIELD: adhesives, in particular for power assembly of devices. ^ SUBSTANCE: heat-resistant up to 3000C, high-processable adhesive composition is provided. Such composition is useful for assembly of materials and metals with various chemical and electrodeposited coatings and manufacture of articles for electronics and radionics engineering; articles of aerospace, subaqueous and marine applications, maintaining under durable elevated vibrating, mechanical and alternating loads. Claimed composition sufficiently consists epoxytitanium organosiloxane resin as a base; substituted 4,4-diphenylmethanediisocianate as a curing agent; condensation product of phenol with epichlorohydrin as a diluent; and mixture of low molecular polyamines or 2,4,6-tris(dimethylaminomethyl)phenol as an promotor. ^ EFFECT: adhesive composition with improved heat-resistance and workability. ^ 6 cl, 4 ex |
