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发明名称
PACKAGE SYSTEM WITH COVER STRUCURE AND METHOD OF OPERATION THEREOF
摘要
A package system includes: an exostructure; a ceramic panel attached to the exostructure; and an internal device component housed in the exostructure.
申请公布号
EP2918150(A4)
申请公布日期
2016.06.15
申请号
EP20130853560
申请日期
2013.11.11
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
VALLEJO, ALEJANDRO E;BEENE, JEFFREY F;LEE, JI-YEON;ROSENBLATT, MICHAEL N;AIMI, ROBERTO M;GREGG, JUSTIN L.
分类号
H05K5/02;G06F1/18;H04M1/02;H04M1/18
主分类号
H05K5/02
代理机构
代理人
主权项
地址
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