发明名称 HALOGEN-FREE RESIN COMPOSITION AND USES THEREOF
摘要 Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.
申请公布号 EP3031863(A1) 申请公布日期 2016.06.15
申请号 EP20140882269 申请日期 2014.03.21
申请人 SHENGYI TECHNOLOGY CO. LTD. 发明人 YANG, HU;HE, YUESHAN
分类号 C08L79/04;B32B15/08;B32B15/20;B32B27/04;B32B27/20;B32B27/28;C08G14/06;C08J5/24;C08K3/36;C08K7/18;C08L25/10;C08L61/34;C08L71/12;C08L79/02;C08L85/02;H05K1/03;H05K3/02 主分类号 C08L79/04
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