| 摘要 |
PROBLEM TO BE SOLVED: To transfer a useful layer to a receiver substrate.SOLUTION: A process for transferring a useful layer to a receiver substrate is provided that comprises: a step a) of providing a donor substrate comprising an intermediate layer located between a carrier substrate and a useful layer, the intermediate layer configured to be plastically deformed when heated to a temperature at or above a first temperature; a step b) of providing a receiver substrate; a step c) of assembling the receiver substrate and the donor substrate such that the useful layer and the intermediate layer are disposed between the carrier substrate and the receiver substrate; and a step d) of carrying out the heat treatment on the receiver substrate and the donor substrate after the step c), the heat treatment being carried out at a second temperature above the first temperature, wherein the intermediate layer does not include chemical species susceptible to degassing, an additional layer is formed and is diffused into the additional layer in the step d) and includes chemical species suitable for forming a weak zone in the intermediate layer.SELECTED DRAWING: Figure 5 |
