| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated sheet which can prevent a decrease in adhesive force and electrical reliability of a resin composition layer, and in which back grind tapes can be stripped from a plurality of semiconductor devices in block after dicing.SOLUTION: A laminated sheet comprises: a back grind tape having a structure in which an adhesive layer is formed on a base; and a resin composition layer provided on the adhesive layer of the back grind tape. A tensile elasticity of the adhesive layer is 0.1 to 5.0 MPa at 23°C, The peel strength T between the adhesive layer and the resin composition layer is 0.1 to 5 N/20 mm under a condition of 23°C and 300 mm/minute. |
