| 摘要 |
Provided are a wafer polishing apparatus which can accurately measure the thickness of a wafer to be polished, and can improve a polishing quality; and a method for polishing a wafer. According to an embodiment of the present invention, the wafer polishing apparatus comprises: a lower surface plate; an upper surface plate arranged on the lower surface plate, and rotating; a carrier receiving a wafer, and arranged on the lower surface plate; and a sensor unit irradiating light to the wafer received in the carrier, detecting light reflected by the wafer, and outputting detection data according to the detected result. The sensor unit rotates with the upper surface plate. |
