COPPER FOIL WITH CARRIER, LAMINATE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

摘要

The present invention provides copper foil with an attached carrier capable of forming an ultra-micro circuit and appropriately restraining a circuit from being disconnected. The copper foil has the attached carrier which orderly comprises: an intermediate layer; and an ultra-thin copper layer on one surface or both surfaces of the carrier, wherein the ultra-thin copper layer is an electrolysis copper layer, the thickness of the ultra-thin copper layer is 1.5um or less, when the thickness of the ultra-thin copper layer is measured by a gravimetric method, and the number of pinholes of the ultra-thin copper layer is between zero per m^2 and five per m^2.