| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device with short polishing time.SOLUTION: The polishing device according one an embodiment includes: a stage for retaining a wafer; a polishing part for polishing a membrane formed on a peripheral edge of the wafer; a detection part for detecting a residual part of the membrane on the peripheral edge; a first movable part for moving the detection part along a surface of the peripheral edge; and a control part for controlling the polishing part on the basis of a state of the peripheral edge detected by the detection part.SELECTED DRAWING: Figure 1 |
