SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREFOR

摘要

Disclosed are a semiconductor device and a method for manufacturing the same. According to an embodiment, the semiconductor comprises: a substrate; a plurality of thin films formed on the substrate and having a circuit pattern formed thereon; and an insulating layer for insulating the plurality of thin film layers from each other. The plurality of thin film layers are connected through a via pad including a via. The upper part and the lower part of the via pad individually have a protruding pattern, and at least two among the plurality of thin film layers are connected through a stacked via structure.