发明名称 SUBSTRATE WITH DETERMINATE THERMAL EXPANSION COEFFICIENT
摘要 The invention relates to a composite support (10) intended to receive a transferred layer (20) made of a material chosen from crystalline materials, so that the assembly forms a substrate (30) for epitaxy, characterized in that it has a longitudinal plane of symmetry (100) parallel to its principal surfaces and in that it consists of: . a central first layer (1) having a first thermal expansion coefficient at a defined temperature T, the said layer extending transversely on either side of the plane of symmetry; and . at least one pair of lateral layers (2, 2', 3, 3'), the layers of each pair having, facing each other: -arrangements in the composite support (10) that are substantially symmetrical with respect to the plane of symmetry; - second thermal expansion coefficients at the temperature T that are substantially identical to each other; and - thicknesses substantially identical to each other; and in that the materials constituting the layers of the composite support (10) are chosen in such a way that the composite support (10) has an overall thermal expansion coefficient at the temperature T close to the thermal expansion coefficient of the material of the transferred layer (20) at the temperature T. The invention also relates to processes for forming a useful layer on the said composite support and to structures comprising substrates for epitaxy.
申请公布号 KR20060113983(A) 申请公布日期 2006.11.03
申请号 KR20067013398 申请日期 2006.07.04
申请人 S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES 发明人 LE VAILLANT YVES MATTHINEU
分类号 H01L21/20;C30B25/18;H01L21/762 主分类号 H01L21/20
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