发明名称 |
IMPLANTABLE POWER PACK |
摘要 |
Disclosed is an implantable power pack. In one implementation, the implantable power pack includes a housing, a power output port disposed on the housing, a resonant network configured to receive a wireless power transfer from an external primary power source, a power transfer secondary electronics component configured to convert alternating current power received from the resonant network to direct current power, and a power management component configured to provide the direct current power through the power output port. |
申请公布号 |
US2016303301(A1) |
申请公布日期 |
2016.10.20 |
申请号 |
US201615096886 |
申请日期 |
2016.04.12 |
申请人 |
MINNETRONIX, INC. |
发明人 |
Bluvshtein Vlad;Lucke Lori |
分类号 |
A61M1/10;A61M1/12;H02J7/04;H02J50/80;H02J50/12;H02J7/02 |
主分类号 |
A61M1/10 |
代理机构 |
|
代理人 |
|
主权项 |
1. An implantable power pack, comprising:
a housing; a power output port disposed on the housing; a resonant network included within the housing and configured to receive a wireless power transfer from an external primary power source; a power transfer secondary electronics component included within the housing, connected to the resonant network, and configured to convert alternating current power received from the resonant network to direct current power; and a power management component included within the housing, connected to the power transfer secondary electronics component, and configured to provide the direct current power through the power output port. |
地址 |
Saint Paul MN US |