发明名称 Modular heat-transfer systems
摘要 Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from an operable element. A manifold module can have a distribution manifold and a collection manifold. A decoupleable inlet coupler can be configured to fluidicly couple the distribution manifold to a respective heat-transfer element. A decoupleable outlet coupler can be configured to fluidicly couple the respective heat-transfer element to the collection manifold. An environmental coupler can be configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold.
申请公布号 US9496200(B2) 申请公布日期 2016.11.15
申请号 US201213559340 申请日期 2012.07.26
申请人 COOLIT SYSTEMS, INC. 发明人 Lyon Geoff Sean;Holden Mike;Gierl Brydon
分类号 F28F7/00;F28D15/00;F28F9/02;H01L23/473;H05K7/20 主分类号 F28F7/00
代理机构 Ganz Pollard LLC 代理人 Ganz Pollard LLC
主权项 1. A modular heat-transfer system comprising: an array having a plurality of heat-transfer elements, each defining an inlet and an outlet and having at least one component heat-exchange module in thermal contact with a corresponding operable element to provide conduction heat-transfer between the at least one component heat-exchange module and the corresponding operable element, wherein the at least one component heat-exchange module is configured to transfer heat to a working fluid from the operable element, or to transfer heat from the working fluid to the operable element, wherein the at least one component heat-exchange module comprises a pump positioned in the at least one component heat-exchange module and being configured to urge the working fluid through the respective heat-transfer element; a manifold module having a distribution manifold and a collection manifold, a decoupleable inlet coupler corresponding to each respective inlet of each respective heat-transfer element in the array, wherein the respective inlet coupler is configured to fluidicly couple the distribution manifold to the inlet of the respective heat-transfer element; a decoupleable outlet coupler corresponding to each respective outlet of each respective heat-transfer element in the array, wherein the respective outlet coupler is configured to fluidicly couple the outlet of the respective heat-transfer element to the collection manifold; and an environmental coupler configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold, wherein no pumps other than the pumps in the component heat-exchange modules circulate the working fluid among the plurality of heat-transfer elements, the manifold module, and the environmental coupler.
地址 Calgary CA