Printed interconnects for semiconductor packages

摘要

A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.

主权项

1. A packaged semiconductor device, comprising:
a first semiconductor die having a plurality of bond pads thereon mounted face up on a substrate having a plurality of substrate pads; a first dielectric layer comprising a first ink residue extending from said plurality of substrate pads to said plurality of bond pads; and a first electrically conductive interconnect comprising a second ink residue on said first dielectric layer extending from said respective ones of said plurality of substrate pads to respective ones of said plurality of bond pads to connect said respective ones of said plurality of substrate pads to said respective ones of said plurality of bond pads.