Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes

摘要

The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

主权项

1. A temporary bonding method comprising:
providing a stack comprising:
a first substrate having a back surface and a front surface;a bonding layer adjacent said front surface, said bonding layer being formed from a composition comprising a cyclic olefin polymer dissolved or dispersed in a solvent system; anda second substrate having a first surface; and separating said first and second substrates without subjecting said stack to heat, wherein said stack is exposed to a temperature of less than about 100° C. for about 60 seconds prior to said separating.