发明名称 積層体
摘要 PROBLEM TO BE SOLVED: To reduce warpage of a laminated body which occurs when the laminated body is heated.SOLUTION: A laminated body 10 is formed by laminating a substrate 1 and a support body 2 supporting the substrate 1. In the laminated body 10, a warpage reducing film 5 for reducing warpage of the laminated body 10, which is caused by heating, is provided on a surface of the support body 2 which is opposite to the side where the substrate 1 is laminated.
申请公布号 JP6030358(B2) 申请公布日期 2016.11.24
申请号 JP20120149974 申请日期 2012.07.03
申请人 東京応化工業株式会社 发明人 吉岡 孝広;今井 洋文;久保 安通史;野口 拓也;緒方 寿幸
分类号 H01L21/304;B32B9/00;H01L21/02 主分类号 H01L21/304
代理机构 代理人
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