| 摘要 |
The present invention relates to a semiconductor package using a metal cap, comprising: a substrate; a semiconductor device mounted on the substrate; a first connection part for connecting the substrate and the semiconductor device; and a metal cap which surrounds the semiconductor device and is bonded to the substrate. An inner space generated when the substrate and the metal cap are bonded is sealed and is shielded from the outside. Thus, the present invention prevents the properties of the semiconductor device from being changed by maintaining the mechanical and electrical functions of the semiconductor device while completely shielding the semiconductor device from the outside, and protecting the semiconductor device from entrance of foreign substances. |
