发明名称 |
MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF WRAPPING MATERIAL FOR ELECTRONIC COMPONENT CASE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wrapping material for an electronic component case which can control equipment costs and achieve high production speed. <P>SOLUTION: The manufacturing method comprises a temporary bonding process of temporarily bonding the first sheet 1 made by laminating a thermoplastic resin layer 5 on one surface of a thermoplastic resin unstretched film layer 4 to the second sheet 2 made by laminating an aluminum foil layer 7 on one surface of a thermoplastic resin stretched film layer 6 to obtain a preliminary laminated sheet 3 by inserting the first sheet 1 and the second sheet 2 through a pair of rolls 12 and 13 in such a manner that the thermoplastic resin layer 5 comes in contact with the aluminum foil layer 7, heating and pressing them in the state that the thermoplastic resin is not molten; and a main bonding process of bonding the first sheet 1 and the second sheet 2 to integrate them into one body by heating the preliminary laminated sheet 3 and melting the thermoplastic resin. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2006305967(A) |
申请公布日期 |
2006.11.09 |
申请号 |
JP20050133817 |
申请日期 |
2005.05.02 |
申请人 |
SHOWA DENKO PACKAGING CO LTD |
发明人 |
HATA HIROSHI |
分类号 |
B29C65/40;B29C65/20;B29K105/22;B29K705/02;B29L9/00;B32B15/08;B65D65/40;H01M2/02 |
主分类号 |
B29C65/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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