| 摘要 |
PURPOSE:To reduce the occupation area of a bonding pad and to improve the integration degree of an integrated circuit chip by a method wherein an insulating film is provided on the integrated circuit chip and a lead metal film provided on this insulating film is connected to the bonding pad using a metal layer for connection use provided on a window. CONSTITUTION:An insulating film 4 is provided on an integrated circuit chip 1 and a rectangular window 6 is openly provided in the film 4 in such a way that it intersects a bonding pad 2 and its peripheral edges are faced upward and are formed into an oblique shape. Moreover, a lead metal film 7 obtainable by forming a metal film into a necessary lead pattern is formed on the upper surface of the film 7 facing this window 6. One end of the film 7 is formed also on the peripheral edge part of the window 6 and the film 7 is brought into contact to the pad 2 at this peripheral edge part. Moreover, a metal layer 8 for connection use is applied on the window 6 and the pad 2 and the film 7 are electrically connected to each other by the layer 8. Thereby, it becomes possible to constitute the pad 2 into a rectangular shape and the occupation area of the pad can be reduced. |
