发明名称 |
Coating apparatus and method |
摘要 |
A coating apparatus comprises a chuck on which a semiconductor wafer is adhered, a resist liquid supplying system for supplying a resist liquid to the semiconductor wafer, a motor for rotating the semiconductor wafer, thereby spreading the resist liquid over the semiconductor wafer, and a plate, on which the semiconductor wafer is placed, for creating a temperature distribution on the semiconductor wafer.
|
申请公布号 |
US5580607(A) |
申请公布日期 |
1996.12.03 |
申请号 |
US19940186879 |
申请日期 |
1994.01.26 |
申请人 |
TOKYO ELECTRON LIMITED;TOKYO ELECTRON KYUSHU LIMITED |
发明人 |
TAKEKUMA, TAKASHI;MURAKAMI, MASAAKI;DEGUCHI, MASATOSHI;FUJIMOTO, AKIHIRO |
分类号 |
B05C11/08;B05D1/00;H01L21/00;(IPC1-7):B05D3/12 |
主分类号 |
B05C11/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|