| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily and rapidly conduct the coating operation of adhesive on an IC module. SOLUTION: An adhesive coating jig J is constituted by aligning an adhesive sheet 20 coated with adhesive 23 around insertion holes 21 of the upper surface at a release sheet formed with the holes 21 making it possible to insert an IC chip 2 at a base plate 10 formed with a plurality of recesses 11 making it possible to movably engage the chip 2 with a predetermined plate 30 formed with insertion holes 31, and sequentially superposing to continue the recesses 11, the holes 21 and 31. The IC module M is coated with adhesive by charging the module M from the hole 31 of the plate 30 of the jig J, lightly urging it, and transferring the adhesive 32 of the sheet 20 around the chip 2 of the board 1.</p> |
