| 摘要 |
PROBLEM TO BE SOLVED: To provide a glass circuit substrate which allows the formation of wirings by wet process plating without formation of special under costing layers on a glass surface and without impairment of the smoothness of the glass surface with reduced deterioration in adhesion property in spite of the thermal influence from outside. SOLUTION: This glass circuit substrate has a catalyst nucleus layer 2 consisting of metal Pd formed on a glass substrate 1 and an amorphous Pd-P plating layer 3 formed on this catalyst nucleus layer 2. The film thickness of this amorphous Pd-P plating layer 3 is 0.015 to 0.500μm. The content of the phosphorus in the amorphous Pd-P plating layer 3 is 3.0 to 10.0(wt.%).
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