| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase throughput in scanning exposure by shortening exposure time. <P>SOLUTION: When a pattern is transferred continuously to two adjacent shot regions in a Y-axis direction on a wafer W, control is performed so that a scanning direction when one shot region is transferred is reverse to that when the other is transferred for a reticle stage RST, and a scanning direction when one shot region is transferred is the same as that when the other is transferred for a wafer stage WST. When the scanning direction of the reticle stage RST is the same as that of the wafer stage WST, a projection optical system PL is controlled so that the erect image of a pattern in a lighting region IAR is formed onto an exposure region IA. When the scanning direction of the reticle stage RST in the transfer is reverse to that of the wafer stage WST, the projection optical system PL is controlled so that an inverted image of the pattern in the lighting region IAR is formed onto the exposure region IA. <P>COPYRIGHT: (C)2007,JPO&INPIT |
