| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a heat radiation structure capable of radiating heat directly from itself and to provide a manufacturing method thereof. <P>SOLUTION: An uneven part in an irregular shape and spherical projection parts or a metal film which is a sort of gold black and has superior radiation property is formed on the surface of a semiconductor substrate in order to radiate the heat generated by a semiconductor element on the semiconductor substrate from the surface of the semiconductor substrate. A heat radiation structure like this radiates heat from the heat radiation structure itself, so heat radiation efficiency can be improved. The uneven part etc., can be formed by etching the semiconductor substrate. The metal film can be formed by vapor deposition etc. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
