发明名称 HEAT RECEIVING SHEET, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING THE SHEET
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat receiving sheet which can protect an electronic component easily affected by heat with no displacement, an electronic apparatus comprising the heat receiving sheet, and a method for manufacturing the heat receiving sheet. <P>SOLUTION: Electronic components 4, 5, and 6 of high heat generation are brought into contact with a heat transfer 11 of a heat receiving sheet 1, while a low temperature component 7 which is an electronic component that heats less and is easily affected by heat comes in contacts with a heat insulator 12 of the heat receiving sheet 1. The heat generated at the heating components 4, 5, and 6 is transferred to the heat receiving sheet 1 (heat transfer 11) which contacts them, and the heat flow is transferred to a core member 8 and a case 2, thus cooling the heating components 4, 5, and 6. Since the low temperature component 7 contacts the heat insulator 12, the heat generated by the heating components 4, 5, and 6 is not transferred by way of the heat receiving sheet 1, while protected from a surrounding heat radiation, resulting in receiving no thermal damage. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006269685(A) 申请公布日期 2006.10.05
申请号 JP20050084794 申请日期 2005.03.23
申请人 FUJITSU LTD 发明人 ISHIZUKA MASANOBU
分类号 H05K7/20;H01L23/36 主分类号 H05K7/20
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