发明名称 |
INTEGRATING PASSIVE COMPONENTS ON SPACER IN STACKED DIES |
摘要 |
AN EMBODIMENT OF THE PRESENT INVENTION IS A TECHNIQUE TO INTEGRATE PASSIVE COMPONENTS IN A DIE ASSEMBLY (100).A CAPACITOR, INDUCTOR, OR RESISTOR (230) IS INTEGRATED ON A SPACER (220) BETWEEN UPPER AND LOWER DIES IN STACKED DIES.CONDUCTORS ARE ATTACHED TO THE CAPACITOR, INDUCTOR OR RESISTOR (230) TO CONNECT THE CAPACITOR, INDUCTOR, OR RESISTOR TO AT LEAST ONE OF THE UPPER AND LOWER DIES.(FIG 1) |
申请公布号 |
MY128034(A) |
申请公布日期 |
2007.01.31 |
申请号 |
MY2004PI04291 |
申请日期 |
2004.10.19 |
申请人 |
INTEL CORPORATION |
发明人 |
KANG, JUNG;RADHAKRISHNAN, KALADHAR;CHIKAMENAHALLI, SHAMALA A. |
分类号 |
H01L23/02;H01L23/522;H01L23/66;H01L25/065;H01L25/16 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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