WAFER LEVEL PACKAGE FOR SURFACE ACOUSTIC WAVE DEVICE AND FABLICATION METHOD THEREOF

摘要

A wafer level package for a surface acoustic wave(SAW) device and a packaging method thereof are provided to prevent breakdown or damage of the package due to thermal expansion or shrinkage by having an equal thermal expansion coefficient of a SAW device wafer and a packaging cap. A SAW(Surface Acoustic Wave) device(110) has a SAW element(112) on an upper plane of a device wafer. A cap wafer(120) is bonded to the top of the SAW device. A cavity part(130) is prepared to accommodate the SAW device between the cap wafer and the SAW device. A cap pad(121) is formed on an upper surface of the cap wafer. A metal line(122) is formed to penetrate through the cap wafer in order to connect the cap pad and the SAW device. The device wafer and the cap wafer are made of the same material.