LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING SAME

摘要

PROBLEM TO BE SOLVED: To provide a light emitting device package and a method for manufacturing the same.

SOLUTION: It is possible to reduce the package in size by electrically linking the light emitting device with other devices without using wire bonding to reduce the space for wire bonding. Further, it is possible to improve light extraction of the light emitting device eliminating wiring region by using a conductive interconnection, easily an evenly applying fluorescent material, and reducing the area that absorbs vertically emitted light.

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