| 摘要 |
An electronics module can include a wiring substrate with openings. The wiring substrate can have traces, and semiconductor dies can be attached by a first relatively weak adhesive to the wiring substrate. Electrical connections through the openings can electrically connect the traces and the terminals. Another adhesive can more strongly adhere the dies to the wiring substrate. The electronics module can be made by a process that includes attaching the semiconductor dies to the wiring substrate with a relatively weak adhesion, electrically connecting through the openings the traces and the terminals, and more securely attaching selected ones of the dies to the wiring substrate.
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