| 摘要 |
The present invention relates to a semiconductor device having a passive device. The semiconductor device includes a substrate and at least one passive device. The substrate has at least one via. The via has at least two conductive elements therein. The conductive elements are not electrically connected to each other. The passive device has at least two electrodes, and is disposed on the substrate. The electrodes are electrically connected to the conductive elements respectively. The passive device needs only one via, so the amount of vias can be reduced effectively. In addition, the conductive path formed by the conductive elements and the passive device is relatively short, so that the inductance is lowered and the electrical performance is raised.
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