Multilayer ceramic electronic part, board having the same mounted thereon, and manufacturing method thereof

摘要

A multilayer ceramic electronic part may include: a ceramic body; an active layer including a plurality of first and second internal electrodes disposed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween; an upper cover layer formed on an upper portion of the active layer; a lower cover layer formed on a lower portion of the active layer and having a thickness thicker than that of the upper cover layer; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes include: first and second conductive layers extended from both end surfaces of the ceramic body onto upper and lower main surfaces thereof; and first and second insulation layers formed on the first and second conductive layers disposed on both end surfaces of the ceramic body.

主权项

1. A multilayer ceramic electronic part comprising:
a ceramic body including a plurality of dielectric layers; an active layer including a plurality of first and second internal electrodes disposed in the ceramic body and disposed to be alternately exposed to end surfaces of the ceramic body, the dielectric layers being interposed between the first and second internal electrodes; an upper cover layer disposed on an upper portion of the active layer; a lower cover layer disposed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes include: first and second conductive layers extended from the end surfaces of the ceramic body onto upper and lower main surfaces thereof; and first and second insulation layers disposed on the first and second conductive layers disposed on the end surfaces of the ceramic body, and wherein the first and second external electrodes further comprise first and second plating layers formed to cover portions of the first and second conductive layers disposed on upper and lower main surfaces of the ceramic body and edges of the first and second insulation layers.