发明名称 |
Semiconductor device having a resistor and methods of forming the same |
摘要 |
In a semiconductor device and a method of making the same, the semiconductor device comprises a substrate including a first region and a second region. At least one first gate structure is on the substrate in the first region, the at least one first gate structure including a first gate insulating layer and a first gate electrode layer on the first gate insulating layer. At least one isolating structure is in the substrate in the second region, a top surface of the isolating structure being lower in height than a top surface of the substrate. At least one resistor pattern is on the at least one isolating structure. |
申请公布号 |
US9379115(B2) |
申请公布日期 |
2016.06.28 |
申请号 |
US201314089075 |
申请日期 |
2013.11.25 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Shin Jinhyun;Kim Minchul;Cho Seong Soon;Chol Seungwook |
分类号 |
H01L27/105;H01L27/06;H01L27/115;H01L49/02 |
主分类号 |
H01L27/105 |
代理机构 |
Onello & Mello, LLP |
代理人 |
Onello & Mello, LLP |
主权项 |
1. A method of forming a semiconductor device comprising:
providing a gate insulating layer on a substrate, the substrate having an upper surface; providing an isolating structure in the substrate; providing a first gate electrode layer on the gate insulating layer; removing a portion of the first gate electrode layer and a portion of the gate insulating layer to expose the isolating structure; removing an upper portion of the exposed isolating structure to recess the isolating structure in the substrate so that a top surface of the isolating structure is lower in height than the upper surface of the substrate; providing a second gate electrode layer on the recessed isolating structures; patterning the second gate electrode layer to form a resistor pattern on the recessed isolating structure; providing an insulating layer on the resistor pattern; and planarizing the insulating layer, wherein a portion of the insulating layer remains on the resistor pattern to cover the resistor pattern. |
地址 |
KR |