发明名称 Semiconductor device having a resistor and methods of forming the same
摘要 In a semiconductor device and a method of making the same, the semiconductor device comprises a substrate including a first region and a second region. At least one first gate structure is on the substrate in the first region, the at least one first gate structure including a first gate insulating layer and a first gate electrode layer on the first gate insulating layer. At least one isolating structure is in the substrate in the second region, a top surface of the isolating structure being lower in height than a top surface of the substrate. At least one resistor pattern is on the at least one isolating structure.
申请公布号 US9379115(B2) 申请公布日期 2016.06.28
申请号 US201314089075 申请日期 2013.11.25
申请人 Samsung Electronics Co., Ltd. 发明人 Shin Jinhyun;Kim Minchul;Cho Seong Soon;Chol Seungwook
分类号 H01L27/105;H01L27/06;H01L27/115;H01L49/02 主分类号 H01L27/105
代理机构 Onello & Mello, LLP 代理人 Onello & Mello, LLP
主权项 1. A method of forming a semiconductor device comprising: providing a gate insulating layer on a substrate, the substrate having an upper surface; providing an isolating structure in the substrate; providing a first gate electrode layer on the gate insulating layer; removing a portion of the first gate electrode layer and a portion of the gate insulating layer to expose the isolating structure; removing an upper portion of the exposed isolating structure to recess the isolating structure in the substrate so that a top surface of the isolating structure is lower in height than the upper surface of the substrate; providing a second gate electrode layer on the recessed isolating structures; patterning the second gate electrode layer to form a resistor pattern on the recessed isolating structure; providing an insulating layer on the resistor pattern; and planarizing the insulating layer, wherein a portion of the insulating layer remains on the resistor pattern to cover the resistor pattern.
地址 KR