| 摘要 |
The invention provides a component built-in module which prevents short circuit caused by solder and other jointing materials, so as to improve connection property of an external substrate. Since the interval between centers of adjacent first terminal electrode used for external connection is larger than the interval between centers of adjacent second terminal electrode used for internal connection, short circuit of a jointing portion caused by solder and other jointing materials is prevented, and each first terminal electrode and the external substrate join on the jointing portion. In addition, area of the lower surface of a resin multilayer substrate provided with the first terminal electrode is wider than the area of the upper surface of the resin multilayer substrate provided with the second terminal electrode, so area of the jointing portion where the first terminal electrodes and an external electrode join, thereby improving joining strength. Therefore, the component built-in module which can improve connection property with the external substrate is provided. |
