| 摘要 |
A semiconductor chip (12) is mounted on a wiring board that has a two-layer lead structure (1, 2). One of the leads (1a) used for receiving input signals is disposed on the lower layer (1) and runs underneath the semiconductor chip (12) forming an U-shaped wiring line while other leads (2a-h) are disposed on the upper layer (2). Because one (2b) of the upper layer leads (2) for receiving input signals is disposed in the U-shaped pocket of the U-shaped wiring line (1a) of the lower layer (1), the relative positioning of corresponding terminals (INa2, INb1) can be changed into a reversal of the positioning of the electrode pads (Ib1, Ia2) of the chip (12) connected to the terminals (INa2, INb1). Furthermore, one (2h) of the upper layer lead (2) for receiving control signals is placed between the chip (12) and the lower layer lead (2) underneath the chip (12) to prevent high frequency signal interference. |
