| 摘要 |
A method and apparatus for the additive fabrication of single and multi-layer electronic circuits by using directed local deposition of conductive, insulating, and/or dielectric materials to build circuit layers incorporating conductive, insulating and/or dielectric features, including inter-layer vias and embedded electronic components. Different conductive, insulating, and/or dielectric materials can be deposited at different points in the circuit such that any section of the circuit may be tailored for specific electrical, thermal, or mechanical properties. This enables more geometric and spatial flexibility in electronic circuit implementation, which optimizes the use of space such that more compact circuits can be manufactured. |
