LIGHT EMITTING DEVICE, LEAD FRAME AND RESIN CAVITY MOLDING PACKAGE

摘要

Pkg resin crack is suppressed after dicing.;A light emitting device 1 where a light emitting device 2 that emits light is mounted on a lead frame 3 and that uses a resin cavity molding package 5 having an integrally molded lead frames 3, 4 constituting electrodes that correspond to the light emitting element 2 and resin, wherein roundness is given to a part or all of a cutting plane corner part of a retention section (hanger lead 3a, 4a) that become a cause of crack generation due to the retention sections (hanger leads 3a, 4a) of the lead frames giving stress concentration to resin at the time of cutting by a blade 7.

主权项

1. A light emitting device comprising:
a resin cavity molding package having resin and integrally molded lead frames each constituting an electrode, wherein at least one of the lead frames has a retention section extending from said at least one of the lead frames towards an outer surface of the resin cavity molding package, wherein a periphery of the retention section is surrounded by the resin, wherein the retention section has a cut and exposed plane that is coplanar with the outer surface of the resin cavity molding package, wherein a part or all of cut and exposed plane corner parts of retention section of the lead frames is rounded off; and one or a plurality of light emitting elements that emit light mounted in the resin cavity molding package; wherein each light emitting element is mounted on a first lead frame that constitutes a first electrode, and conductively connected to a second electrode.