发明名称 |
PACKAGING MODULE OF POWER CONVERTING CIRCUIT AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
The disclosure discloses a packaging module of a power converting circuit and a method for manufacturing the same. The packaging module of the power converting circuit includes a substrate, a molding layer and a plurality of pins. A power device is assembled at the substrate, a plurality of pins electrically are coupled to the power device, the molding layer covers the surface of the substrate with the power device, and at least a contact surface of the pins configured to electrically connect an external circuit is exposed. The molding layer includes a main hat-body part and a hat-brim part, the main hat-body part and the hat-brim part form a hat-shaped molding layer, and the hat-brim part is used to increase a creepage distance between the contact surfaces of the pins located at the top of the molding layer and the bottom of the substrate. |
申请公布号 |
US2016254218(A1) |
申请公布日期 |
2016.09.01 |
申请号 |
US201615051852 |
申请日期 |
2016.02.24 |
申请人 |
DELTA ELECTRONICS,INC. |
发明人 |
HONG Shouyu;LU Kai;ZHAO Zhenqing |
分类号 |
H01L23/498;H01L21/48;H01L23/29;H01L23/31;H01L21/56;H01L21/78 |
主分类号 |
H01L23/498 |
代理机构 |
|
代理人 |
|
主权项 |
1. A packaging module of a power converting circuit comprising:
a substrate; a power device mounted on a surface of the substrate; a molding layer covering the surface of the substrate; and a plurality of pins electrically coupled to the power device and embedded in the molding layer, wherein each pin is configured to expose at least a contact surface coupled with an external circuit; wherein the molding layer includes a main hat-body part and a hat-brim part, the main hat-body part and the hat-brim part form a hat-shaped molding layer, and the hat-brim part is used to increase a creepage distance between the contact surfaces of the pins located at the top of the molding layer and the bottom of the substrate. |
地址 |
TAOYUAN CITY CN |