PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS

摘要

Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

主权项

1. A packaged semiconductor component, comprising:
a semiconductor die having a first composition; a support member attached to the semiconductor die, the support member being at least substantially rigid and having a second composition different from the first composition of the semiconductor die; a substrate carrying the semiconductor die and the support member attached to the semiconductor die; and an encapsulant at least partially encasing the semiconductor die, the support member, and the substrate.