发明名称 Array Formed From A Multiplicity Of Electric Integrated Circuits, and Method For Production Thereof
摘要 A method for producing an array formed from a multiplicity of electric integrated circuits, said array being intended for separation and having a conductive connection to a central contact path for bond monitoring, said method comprising the following steps: applying conductive tracks to the array, wherein the separation region is recessed from applying said tracks, andclosing the conductive connection to the central contact path by applying individual conductive connection portions, which extend between two contact paths which enclose the separation region and are arranged adjacent thereto, formed from at least one material from the group comprising the elements gold, palladium, tantalum and nickel and also comprising the alloy containing predominantly at least one of the mentioned elements.
申请公布号 US2016254202(A1) 申请公布日期 2016.09.01
申请号 US201415027346 申请日期 2014.09.29
申请人 MICRO SYSTEMS ENGINEERING GMBH 发明人 Krenkel Michael;Brandl Albert;Gossler Joerg
分类号 H01L21/66;H01L21/78;H01L23/00 主分类号 H01L21/66
代理机构 代理人
主权项 1. A method for producing an array formed from a multiplicity of electric integrated circuits, said array being intended for separation and having a conductive connection to a central contact path for bond monitoring, said method comprising the following steps: applying conductive tracks to the array, wherein the separation region is recessed from applying said tracks, and closing the conductive connection to the central contact path by applying individual conductive connection portions, which extend between two contact paths which enclose the separation region and are arranged adjacent thereto, formed from inert material.
地址 Berg DE