| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposing method with which an exposing operation time of an exposing device to proximity expose a substrate to be exposed is shortened. <P>SOLUTION: The proximity exposing method of the substrate to be exposed is conducted by using a mask with a size smaller than that of the substrate to be exposed, at the same time dividing an exposure region of the substrate to be exposed into a plurality of regions, and further changing a mask position with respect to the substrate to be exposed for respective exposing steps. Before proximity exposing the substrate to be exposed, a gap amount between the substrate to be exposed and the mask is measured extending over an entire exposure region of the substrate to be exposed, and when the substrate to be exposed is proximity exposed, the gap amount between the substrate to be exposed and the mask is made to be more than a specified value in regions where the preliminarily measured gap amount is less than the specified value. <P>COPYRIGHT: (C)2007,JPO&INPIT |
