METHOD FOR CONTROLLING CROSS-SECTIONAL SHAPE OF PHOTOSENSITIVE RESIN PATTERN, ELECTROFORMING DIE USING THE SAME, MICROCHEMICAL CHIP, DNA CHIP, AND MEMS PRODUCT

摘要

PROBLEM TO BE SOLVED: To provide a method for obtaining a desired cross-sectional shape as a cross-sectional shape of a fine groove pattern composed of a photosensitive resin material.

SOLUTION: In a method for forming a photosensitive resin pattern by using positive or negative photosensitive resins which are decomposed or hardened with light irradiation, and for forming the groove pattern composed of these photosensitive resins on a substrate with exposure and development, wherein the pattern is to be used for a flow channel of a microchemical chip, a chip for DNA analysis, a resist for chemical etching, and a resist for dry etching and so on, the cross-sectional shape of the photosensitive resin groove pattern is controlled to have a desired value by using proximity exposure as an exposing method, and exposure-developing by selecting a distance 7 between a photomask 3 and the substrate 9 with the photosensitive resin 8 applied thereto or by changing the distance 7 between the substrate and the photomask over time.

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