| 发明名称 | Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus | ||
| 摘要 | The present invention provides an encapsulant with a base for use in semiconductor encapsulation, for collectively encapsulating a device mounting surface of a substrate on which semiconductor devices are mounted, or a device forming surface of a wafer on which semiconductor devices are formed, the encapsulant comprising the base, an encapsulating resin layer composed of an uncured or semi-cured thermosetting resin formed on one surface of the base, and a surface resin layer formed on the other surface of the base. The encapsulant enables a semiconductor apparatus having a good appearance and laser marking property to be manufactured. | ||
| 申请公布号 | US9449856(B2) | 申请公布日期 | 2016.09.20 |
| 申请号 | US201414334060 | 申请日期 | 2014.07.17 |
| 申请人 | SHIN-ETSU CHEMICAL CO., LTD. | 发明人 | Nakamura Tomoaki;Shiobara Toshio;Akiba Hideki;Sekiguchi Susumu |
| 分类号 | H01L23/28;H01L21/56;H01L23/00;H01L23/31 | 主分类号 | H01L23/28 |
| 代理机构 | Oliff PLC | 代理人 | Oliff PLC |
| 主权项 | 1. An encapsulant with a base for use in semiconductor encapsulation, for collectively encapsulating a device mounting surface of a substrate on which semiconductor devices are mounted, or a device forming surface of a wafer on which semiconductor devices are formed, comprising the base being a support substrate composed of an organic resin substrate or a silicon wafer, an encapsulating resin layer composed of an uncured or semi-cured thermosetting resin formed on one surface of the base, and a surface resin layer formed on the other surface of the base. | ||
| 地址 | Tokyo JP | ||