发明名称 |
Method of producing GaAs single crystal and GaAs single crystal wafer |
摘要 |
A method of producing a GaAs single crystal having high carrier concentration and high crystallinity and to provide a GaAs single crystal wafer using such a GaAs single crystal. In the method of producing a GaAs single crystal, a vertical boat method is performed with a crucible receiving a seed crystal, a Si material, a GaAs material serving as an impurity, solid silicon dioxide, and a boron oxide material, thereby growing a GaAs single crystal. |
申请公布号 |
US9469916(B2) |
申请公布日期 |
2016.10.18 |
申请号 |
US201214122042 |
申请日期 |
2012.05.16 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
Nakamura Ryoichi;Murakami Motoichi;Miyaji Takehiro |
分类号 |
C30B11/04;C30B11/00;C30B27/00;C30B29/42 |
主分类号 |
C30B11/04 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. A method of producing a GaAs single crystal, wherein a vertical boat method is performed with a crucible storing a seed crystal, a Si material serving as an impurity, a GaAs material, a solid silicon dioxide, and a boron oxide material in which SiO2 is previously added into the boron oxide material, thereby growing a GaAs single crystal,
wherein the solid silicon dioxide is in a disk shape and is provided between the GaAs material and the boron oxide material, a ratio of an area of the solid silicon dioxide to an area of the upper surface of the GaAs material at a start of crystal growth is 90% to 99%, an amount of Si of SiO2 previously added into the boron oxide material is 5 mass % or less, and a sum of an amount of Si of SiO2 in the boron oxide material and an amount of Si in the solid silicon dioxide exceeds 5 mass % of the boron oxide material. |
地址 |
Tokyo JP |