发明名称 Method of producing GaAs single crystal and GaAs single crystal wafer
摘要 A method of producing a GaAs single crystal having high carrier concentration and high crystallinity and to provide a GaAs single crystal wafer using such a GaAs single crystal. In the method of producing a GaAs single crystal, a vertical boat method is performed with a crucible receiving a seed crystal, a Si material, a GaAs material serving as an impurity, solid silicon dioxide, and a boron oxide material, thereby growing a GaAs single crystal.
申请公布号 US9469916(B2) 申请公布日期 2016.10.18
申请号 US201214122042 申请日期 2012.05.16
申请人 DOWA ELECTRONICS MATERIALS CO., LTD. 发明人 Nakamura Ryoichi;Murakami Motoichi;Miyaji Takehiro
分类号 C30B11/04;C30B11/00;C30B27/00;C30B29/42 主分类号 C30B11/04
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. A method of producing a GaAs single crystal, wherein a vertical boat method is performed with a crucible storing a seed crystal, a Si material serving as an impurity, a GaAs material, a solid silicon dioxide, and a boron oxide material in which SiO2 is previously added into the boron oxide material, thereby growing a GaAs single crystal, wherein the solid silicon dioxide is in a disk shape and is provided between the GaAs material and the boron oxide material, a ratio of an area of the solid silicon dioxide to an area of the upper surface of the GaAs material at a start of crystal growth is 90% to 99%, an amount of Si of SiO2 previously added into the boron oxide material is 5 mass % or less, and a sum of an amount of Si of SiO2 in the boron oxide material and an amount of Si in the solid silicon dioxide exceeds 5 mass % of the boron oxide material.
地址 Tokyo JP