发明名称 |
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF |
摘要 |
A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed. |
申请公布号 |
US2016335470(A1) |
申请公布日期 |
2016.11.17 |
申请号 |
US201615131967 |
申请日期 |
2016.04.18 |
申请人 |
Amkor Technology, Inc. |
发明人 |
Park Sung Sun;Chung Ji Young;Berry Christopher |
分类号 |
G06K9/00;H01L23/00;H01L23/31;H01L23/053 |
主分类号 |
G06K9/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A fingerprint sensor device comprising:
a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides; a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, where the bottom die side comprises a sensing area that comprises a fingerprint sensing unit; a plurality of first interconnection structures electrically connecting the bottom die side to the top substrate side; and a protection plate on the top die side through which a fingerprint is sensed, the protection plate having a top plate side, a bottom plate side, and lateral plate sides between the top and bottom plate sides. |
地址 |
Tempe AZ US |