发明名称 FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
摘要 A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
申请公布号 US2016335470(A1) 申请公布日期 2016.11.17
申请号 US201615131967 申请日期 2016.04.18
申请人 Amkor Technology, Inc. 发明人 Park Sung Sun;Chung Ji Young;Berry Christopher
分类号 G06K9/00;H01L23/00;H01L23/31;H01L23/053 主分类号 G06K9/00
代理机构 代理人
主权项 1. A fingerprint sensor device comprising: a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides; a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, where the bottom die side comprises a sensing area that comprises a fingerprint sensing unit; a plurality of first interconnection structures electrically connecting the bottom die side to the top substrate side; and a protection plate on the top die side through which a fingerprint is sensed, the protection plate having a top plate side, a bottom plate side, and lateral plate sides between the top and bottom plate sides.
地址 Tempe AZ US