| 发明名称 |
Bath for electroplating copper-tin alloys |
| 摘要 |
<p>Bath for galvanically depositing Cu-Sn alloys, consisting of H2O, Cu-cyanide, Sn (IV) cpd, alkali metal-cyanide, -hydroxide and complex former and additionally contg. alkali metal phosphate, contains the K-salt of gluconic acid, gluconic acid and/or glucuronic acid as complex former and has a pH of 8-14.</p> |
| 申请公布号 |
EP0698676(A1) |
申请公布日期 |
1996.02.28 |
| 申请号 |
EP19950104355 |
申请日期 |
1995.03.24 |
| 申请人 |
W.C. HERAEUS GMBH |
发明人 |
CAMUS, OTTO;FREY, THOMAS;HEMPEL, WOLFGANG;HERKLOTZ, GUENTER, DR. |
| 分类号 |
C25D3/58;C25D3/60;(IPC1-7):C25D3/40;C25D3/32 |
主分类号 |
C25D3/58 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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