| 摘要 |
PROBLEM TO BE SOLVED: To prevent the service life of wiring from deteriorating by dissipating Joule's heat generated from the wiring effectively. SOLUTION: Heat conducting layers 11-13 composed of a material having high thermal conductivity are provided in the same layer as wiring layers 2, 4, 6. One wiring layer 2, 4, 6 is coupled thermally with the heat conducting layer 11-13 in other layer in order to dissipate heat generated therefrom through a heat dissipating body located contiguously to the heat conducting layer 11-13 in other layer on the outer surface of a semiconductor device. A heat plate formed on the upper surface of semiconductor substrate or semiconductor device is employed as the heat dissipating body. Since Joule's heat generated from the wiring layer can be discharged through thermal conduction, temperature rise of wiring can be suppressed. Consequently, service life of the wiring is prolonged and the current density can be increased. |
