发明名称 BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To control the position and speed of bonding through a small-sized, light-weight system by controlling the position of a swing arm based on positional displacements detected by means of a non-contact displacement sensor, and further controlling the speed of the swing arm based on the result of conversion from positional displacement to speed. SOLUTION: A tapered extended portion 32 is formed on a tool arm 30 on the side opposite the side where a swing arm 7 is installed, and a target 33 is installed on the bottom of the extended portion 32. A supporting post 34 is installed on the top of a base 1. An eddy-current, non-contact displacement sensor 35 is installed on the top of the supporting post 34 in such a manner that the sensor is opposed to the target 33. The non-contact displacement sensor 35 is to detect positional displacements due to swing of the swing arm 7, and is provided with a function of detecting the distance between it and the target 33 on the bottom of the tool arm 30 as positional displacement. This makes it possible to control the position and speed of bonding by means of a small- sized, light-weight system.
申请公布号 JPH09213734(A) 申请公布日期 1997.08.15
申请号 JP19960021292 申请日期 1996.02.07
申请人 TOSHIBA CORP 发明人 SATO TSUYOSHI;OTANI KAZUMI
分类号 H01L21/60 主分类号 H01L21/60
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